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Technical Capabilities
Material
CEM-1,CEM-3,FR-4,PI,Halogen free,HighTG(150-260),Aluminum/Copper/Ceramic,BT Resin,High-frequency
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Layer Coverage
Single-layer to 20layer
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Board Thickness
0.05mm to 7.0mm for Single/Double Sided, 0.2mm up for Multi-layers

Copper Thickness
Inner 1/3oz to 10oz
Outer 0.5oz to 10oz

Minimum Inner Layer Line Width/Spacing
Width/Spacing 3/3mil, samples 1.5mil.

Hole Size tolerance
PTH+/-0.075   NPTH +/-0.05mm

Aspect Ratio
Vias <=12:1

Surface Finished
HASL,OSP,Immersion Gold/Silver/Tin,Gold finger,NiPdAu,Gold selectable

Max PCB Size
1500mmx680mm

Min Inner Layer PAD size
0.05mm

Min Drilling Vias
0.1mm

Min Soldermask Bridge 
4mil(100um)

Max soldermask Plug Hole Diameter
0.60mm(24mil)

Max Gold Thickness of Gold Finger
50U”

Hole Position/Diameter tolerance
+/-2mil(50um)

Impedance Control tolerance
+/-10%
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